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Engage Black BlackVault HSMs

FIPS 140-2 Level 3 HSMs for key mgmt & cryptographic operations.

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Engage Black BlackVault HSMs Description

Engage Black's BlackVault Hardware Security Modules (HSMs) are physical cryptographic devices designed to securely store and manage digital keys for enterprises and organizations. The BlackVault platform is FIPS 140-2 Level 3 certified and performs cryptographic operations — including key generation, key management, and certificate creation — entirely within the hardware itself, without relying on external computers or servers. The product line consists of three variants: - **BlackVault HSM (TouchScreen):** A general-purpose HSM with an integrated touchscreen display, supporting both networked and offline operation via Ethernet and USB ports. Features a tamper-reactive silicon die shield and an embeddable form factor with fully redundant capabilities. - **BlackVault HSM.TAC:** A ruggedized, small form factor model intended for tactical deployments. Designed for extended temperature ranges and a wide range of tactical infrastructure use cases. - **BlackVault HSM.RAS:** A compact commercial-grade model featuring an integrated smart card reader, tamper-reactive silicon die shield, and long battery life, housed in an extruded aluminum case. All models support AES, RSA, EC, and DSA key types, and signing via SHA256, SHA384, and SHA512 hashes. The platform supports multiple cryptographic APIs including PKCS#11, Java (JCE), and Microsoft CAPI/CNG across various operating systems. Physical tamper resistance is a core security property of all variants. Dimensions for all models are 4"(L) x 6"(W) x 1"(H).

Engage Black BlackVault HSMs FAQ

Common questions about Engage Black BlackVault HSMs including features, pricing, alternatives, and user reviews.

Engage Black BlackVault HSMs is FIPS 140-2 Level 3 HSMs for key mgmt & cryptographic operations. developed by Engage Black. It is a Cloud Security solution designed to help security teams with Hardware Security, Key Management, Cryptography.

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