Egis Technology (Egistec)
Fabless semiconductor firm making fingerprint auth chips and U2F security ICs.

Egis Technology (Egistec)
Fabless semiconductor firm making fingerprint auth chips and U2F security ICs.
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Egis Technology (Egistec) Description
Egis Technology (Egistec) is a Taiwan-based fabless semiconductor company that designs and supplies fingerprint sensor chips, connectivity silicon IPs, and chiplet design turnkey services. The company operates across three primary business areas. In its semiconductor products division, Egis develops fingerprint authentication chips used in mobile devices and laptops, as well as U2F (Universal 2nd Factor) hardware security solutions that enable FIDO-standard two-factor authentication. These products serve OEM clients including HP, Lenovo, Acer, Asus, Compal, Quanta, and Wistron, among others. As a silicon IP company, Egis develops and licenses high-speed connectivity intellectual property, including UCIe (Universal Chiplet Interconnect Express), DDR, LPDDR, and ONFI interface IPs. The company's UCIe IP is positioned as a mass-produced interconnect solution verified by major cloud service provider customers, targeting AI server and chiplet integration use cases. Through its subsidiary Alcor, Egis offers ASIC and chiplet design turnkey services, covering chip design from 3nm to mature process nodes. This includes SoC design, AI accelerator chip design, and advanced packaging services such as CoWoS, WoW, and SoIC. From a security standpoint, Egis focuses on hardware-based biometric authentication (fingerprint sensors) and FIDO U2F authentication solutions embedded in endpoint devices. The company maintains ISO 9001 quality certification and adheres to environmental and conflict minerals compliance standards. Egis has offices in Taiwan, South Korea, Japan, and China.
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